Ather Energy Limited
Architect - Hardware Packaging
- Compensation
- Not disclosed
- Location
- Bengaluru, Karnataka, India
- Work setup
- Not specified
- Seniority
- Not specified
- Employment
- Not specified
- Experience
- 8+ years
- Category
- Hardware
- Posted
Must have
- Deep expertise in 1D/3D stack-up tolerance analysis and GD&T.
- Comprehensive understanding of manufacturing processes (plastics, sheet metal, pressure die-casting, and advanced fabrication techniques).
- Strong abstract thinking and system-level conceptualization capabilities.
- Proficiency in DFMEA, AFMEA, and risk mitigation methodologies.
- Ability to align product architecture and platform roadmaps with advanced manufacturing capabilities.
- Proven experience in high-density and high-voltage electronic packaging.
- Track record of delivering at least three full product development life cycles from concept through mass production.
- Expertise in material science selection for automotive and power electronics environments.
- Structured problem-solving skills using industry best practices (5-Why, Fishbone, RCA, 8D).
Nice to have
- Familiarity with Rigid body dynamics and Engineering mechanics of solids.
- Knowledge of Structural Design principles.
- Understanding of Materials and their properties.
- Familiarity with Sealing strategies, testing and detection .
Full description
Role: Hardware Packaging Architect
Location: IBC Knowledge Park, Bengaluru
Reporting to: Team Lead - Hardware Packaging
Team name: Hardware Packaging Engineering
About the Team and the Role
The Hardware Packaging team at Ather drives the physical design and structural packaging of our next-generation electric vehicle and charging infrastructure platforms, aligning closely with organizational strategic objectives and engineering roadmaps.
As a Hardware Packaging Architect, you will own the end-to-end mechanical and structural packaging architecture, leading cross-functional integration to ensure high reliability, optimal performance, stringent quality, and cost efficiency.
Responsibilities
- Lead the end-to-end design and packaging architecture for vehicle systems and charging infrastructure in alignment with platform requirements.
- Drive product engineering from concept creation down to component levels, consistently achieving schedule, performance, structural, and cost targets.
- Spearhead the hardware packaging technology roadmap through modular design principles and innovative physical layout architectures.
- Author and maintain central physical layout specifications within the Hardware Architecture Master Document.
- Guide component selection for Off-The-Shelf (OTS), Build-To-Spec (BTS), and Build-To-Print (BTP) parts, while designing proprietary box-build enclosures.
- Define and execute strategies for thermal management, ingress protection (IP ratings), environmental sealing, and structural venting.
- Lead engineering design reviews, DFMEA/AFMEA studies, material selection analysis, and manufacturing strategy evaluations.
- Mentor engineering talent, conduct competency assessments, and resolve complex technical root causes.
- Ensure compliance with international standards and regulatory testing (UL, ARAI, BIS, IEC) for electronics and electrical assemblies.
- Maximize platform reusability and design modularity to accelerate time-to-market (TTM), lower unit cost, and enhance quality standards.
Experience and Qualifications
- 8–10 years of experience in hardware packaging, mechanical design, or electromechanical architecture.
- Bachelor’s or Master’s degree (B.E./B.Tech/M.Tech) in Mechanical, Mechatronics, or related engineering discipline from a recognized institute.
Must Have Competencies
- Deep expertise in 1D/3D stack-up tolerance analysis and GD&T.