MediaTek
<Automotive>Automotive Packaging Engineer/Technical Manager
- Compensation
- Not disclosed
- Location
- HsinChu
- Work setup
- Not specified
- Seniority
- Not specified
- Employment
- Not specified
- Experience
- Not specified
- Category
- Not specified
- Posted
Full description
- Automotive Packaging development, New product introduction, Mass production, Supplier management.
- Develop and evaluate the advanced IC Package technology.
- Collaborate with the assembly subcontractors to complete the technology development.
- Qualification and yield improvement for the advanced IC Packages.
- Audit subcontractors.
- MS degree (or above) in Science or Engineering.
- In depth understanding of IC package cost structure, manufacturing, material, process.
- Familiar/experienced with advance IC package development, especially in bumping/Fan-out/WLCSP/2.5D/3D related packages.
- Understanding of different kinds of package structures, such as PBGA/TFBGA/FlipChip/POP/PiP/SiP/Module/InFO.
- Familiar with TO flow, OSAT management, Automotive quality/reliability requirement.