BEOL Process Integration Engineer, up to Sr. Staff
- Compensation
- Not disclosed
- Location
- Hsinchu City, Taiwan
- Work setup
- Onsite
- Seniority
- Staff
- Employment
- Not specified
- Experience
- 4+ years
- Category
- Software engineering
- Posted
Skills
Must have
- B.S., M.S., or Ph.D. in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field.
- Advanced degree (M.S./Ph.D.) preferred for Staff and Senior Staff levels.
- 5+ years of semiconductor industry experience in Back-End Process Integration, Technology Development
- Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committ
- Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information
- To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not aut
- If you would like more information about this role, please contact Qualcomm Careers.
Nice to have
- Strong background in BEOL process integration for advanced logic nodes (sub-5nm preferred); experience in a fabless semiconductor company or as a foundry process engineer with strong customer-facing e
Full description
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Company:
Qualcomm Semiconductor Limited
Job Area:
Engineering Group, Engineering Group > ASICS Engineering
General Summary:
As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives communication, AI, and data processing transformation to help create a smarter, connected future for all.
As a Back-End Process Integration Engineer, you will play a critical role in developing and enabling advanced semiconductor technologies that drive Qualcomm's industry-leading products. You will lead process integration strategy, technology development, qualification, and manufacturing enablement across cutting-edge technology nodes, working closely with foundry partners, OSATs, design, product engineering, reliability, and manufacturing teams. Your contributions will directly impact product performance, power efficiency, quality, reliability, and yield for next-generation SoCs and heterogeneous integration solutions.
The Back-End (BE) Process Integration team is responsible for defining, developing, and optimizing advanced interconnect technologies in collaboration with leading semiconductor foundries. Operating at the intersection of technology innovation and product execution, the team drives BEOL integration strategy for Qualcomm's most advanced mobile, computing, AI, and heterogeneous integration programs.
This role offers the opportunity to influence technology roadmaps, solve complex cross-functional integration challenges, and enable volume manufacturing of industry-leading semiconductor products spanning advanced logic, packaging, and 3D integration technologies.
Key Responsibilities:
- Lead BEOL process integration strategy and technology development for advanced nodes (2nm and beyond) in partnership with leading foundries.
- Serve as Qualcomm’s primary technical interface for BEOL process definition, optimization, qualification, and manufacturing readiness.
- Drive pathfinding and qualification of advanced packaging technologies, including 2.5D/3DIC, chiplets, and heterogeneous integration.
- Translate product PPAC (Power, Performance, Area, and Cost) requirements into robust process specifications and integration solutions.
- Optimize interconnect RC performance and evaluate process options to achieve product and technology objectives.
- Investigate yield, reliability, and parametric issues, driving root-cause analysis and corrective actions with foundry partners.
- Define process control and monitoring strategies to ensure process capability, quality, and manufacturing excellence.