Business Development Manager- Emerging Growth Marketing
- Compensation
- Not disclosed
- Location
- Durham, United States
- Work setup
- Onsite
- Seniority
- Not specified
- Employment
- Not specified
- Experience
- 10+ years
- Category
- Marketing
- Posted
Skills
Must have
- Bachelor's degree in Electrical Engineering, Materials Science, or related technical field.
- 10+ years of experience in business development, strategic partnerships, or sales within advanced semiconductor packaging, materials, or the semiconductor supply chain.
- Strong understanding of advanced packaging architectures (2.5D/3D, CoWoS, EMIB, Foveros, chiplet integration), interconnect technologies (TSV, TSiCV, RDL, hybrid bonding), and thermal management const
- Ability to communicate SiC's technical value proposition (thermal conductivity, mechanical robustness, RF performance) to both engineering and executive audiences at foundries, OSATs, and chip designe
- Proven track record in securing strategic deals, joint development programs, or long-term supply agreements with global semiconductor customers.
- Exceptional negotiation, communication, and executive relationship-building skills.
- Willingness to travel globally.
- Experience developing strategic account plans for key accounts consistent with business unit strategies.
- Ability to qualify opportunities and determine fit for SiC packaging materials across the AI chip supply chain.
- Passion for building breakthrough growth in an emerging, technically complex market.
Full description
We are looking for a Strategic Business Development Manager to accelerate Wolfspeed's entry and growth in the advanced packaging market across a broad and fast-evolving set of emerging platforms — including AI and high-performance computing (HPC), co-packaged optics (CPO) and silicon photonics, quantum computing, and augmented/virtual reality (AR/VR). This role will be a critical driver of our go-to-market strategy for SiC in 2.5D/3D packaging architectures — identifying design-in opportunities, forging ecosystem partnerships, and securing long-term engagements with chipmakers, foundries, OSATs, EDA players, photonics and optical-module vendors, quantum hardware developers, and AR/VR device makers. The ideal candidate combines a deep understanding of advanced semiconductor packaging with a strong commercial mindset, intellectual curiosity about adjacent and nascent applications, and a proven track record of building high-value relationships across the AI chip, photonics, quantum, and immersive-computing supply chains.
The ideal candidate will be located in the San Francisco Bay Area or Phoenix, Arizona.
Key Responsibilities
- Market Expansion: Identify and develop new business opportunities for SiC in advanced packaging applications — including backside cooling layers, passive interposers, and active interposers — across a range of high-growth markets such as AI accelerators and HPC, co-packaged optics and optical I/O, quantum computing systems, and AR/VR platforms (e.g., compact high-density modules, optical engines, photonic interposers, and display driver integration for headsets and smart glasses). Remain open to additional emerging use cases where SiC's material properties create differentiated value.
- Ecosystem Partnerships: Build executive-level relationships with leading AI chip designers (e.g., hyperscalers, GPU/ASIC OEMs), foundries (e.g., TSMC), OSATs, EDA players, photonics/CPO and optical-module suppliers, quantum hardware developers, and AR/VR OEMs and silicon teams to secure design-ins, joint development programs, and long-term supply agreements.
- Strategic Growth Initiatives: Drive co-development programs and PDK-led engagements that embed SiC into customer packaging design flows across AI, HPC, co-packaged optics, quantum, and AR/VR use cases, converting material expertise into durable ecosystem lock-in.
- Deal Structuring & Negotiation: Lead strategic contracts, licensing, and partnership negotiations — balancing revenue growth, risk mitigation, and long-term scalability in nascent but fast-growing markets.
- Voice of Customer: Work closely with materials, technology development, and applications engineering teams to align growth initiatives with SiC process capabilities and packaging integration requirements across data center, photonics, quantum, and immersive-device form factors.