DEPARTMENT MANAGER (DESIGN)
Leads a sustaining product engineering team in Taipei responsible for the health of released semiconductor products and power modules in high-volume production, spanning wafer fab, module assembly, and production test. Focuses on data-driven monitoring (SPC, yield/parametric analytics), root-cause corrective actions, yield/cost improvement, and production test execution with foundry and OSAT partn
- Compensation
- Not disclosed
- Location
- Taipei, tw
- Work setup
- Not specified
- Seniority
- Not specified
- Employment
- Not specified
- Experience
- 5+ years
- Category
- Design
- Posted
Skills
Must have
- Bachelor's degree in Electrical Engineering or related field
- 10+ years semiconductor experience in Product Engineering, Test Engineering, or Manufacturing
- 5+ years leading teams in high-volume production
- Experience managing multi-site or multi-region teams and working cross-functionally without direct authority
- Demonstrated use of data analytics (SPC, yield and parametric analysis, trend and correlation analysis) to drive improvements
- Strong working knowledge of ATE and production test methodologies, yield analysis, failure analysis, and root cause methods
- Understanding of wafer fab, assembly/packaging, and test flows
- Experience working with OSATs, external manufacturers, and ATE/equipment suppliers
Nice to have
- Master's degree
- Experience with power modules or power packaging (IGBT/SiC/GaN modules, power stages, PMICs)
- Hands-on knowledge of module assembly processes and failure modes
- Experience with foundry interfaces and wafer parametric data
- Proficiency with data analysis tools/platforms (JMP, Spotfire, Python/SQL, Power BI/Tableau) and building dashboards or automated monitoring
- Experience with test conversions and ATE platform strategy
- Experience with PCN/ECO processes, SPC and data analytics systems, and automation
- Familiarity with automotive, industrial, or data center power reliability requirements
Full description
About the job
The Senior Manager of Sustaining Product Engineering leads product engineers responsible for the health of released wafer/foundry-based products and power modules in high-volume production. The role covers the full flow: wafer fab, module assembly, and production test. It drives stable manufacturing and continuous yield, quality, and cost improvement. It reports to the Director of Product and Test Sustaining Engineering and partners with Test Engineering, Operations, Quality, Reliability, and foundry and OSAT/assembly partners.
A defining expectation of this role is using data to detect problems early, identify root causes, and drive timely action. The leader builds a data-driven culture in which product health is monitored continuously across wafer, assembly, and test rather than reviewed after the fact.
Job Description
Product Health & Issue Resolution
- Lead sustaining product engineers in resolving production issues across wafer, module assembly, and test, including yield excursions, test escapes, and reliability concerns.
- Drive root cause analysis and closed-loop corrective actions (8D, 5-Why).
- Partner with Quality and Operations on customer returns and field reliability issues.
- Monitor product KPIs (yield, DPPM, test cost, cycle time) and drive corrective actions.
Data-Driven Monitoring & Action
- Establish and own product health dashboards and KPIs (yield, DPPM, test cost, cycle time, scrap, return rates) across wafer, assembly, and test, with clear thresholds and owners.
- Use SPC, parametric trends, and cross-process correlation (wafer sort to module final test to returns) to detect excursions and drift before they affect customers or supply.
- Turn data into decisions: prioritize the highest-impact issues by quantified yield, cost, and risk, and drive each to owned, time-bound corrective actions.
- Run regular data-driven reviews with Operations, Quality, Test, and partners, enforcing action tracking and closure.
- Challenge conclusions with data, including partner-reported data, and require evidence of root cause and effectiveness of corrective actions.
- Drive automation of data collection and analysis, and use modern analytics tools to scale across product lines.
- Coach engineers to apply analytics and to communicate data-based findings clearly to leadership.
Yield Improvement & Cost Optimization
- Drive yield improvement through data analytics, SPC, parametric monitoring, and defect reduction across wafer, assembly (die attach/sinter, wire/clip bond, molding, substrate), and test.
- Use test data and correlation to separate test-related from process- or assembly-related yield loss.
- Deliver cost reduction through test time reduction, multisite optimization, and scrap reduction.