Director - Engineering - UPI/BBPS - FinTech

Role Overview:

We are looking for a Director Engineering to lead the engineering function for a leading FinTech organization, with strong ownership of BBPS and UPI payment platforms. The role will be responsible for building and scaling highly available, secure and resilient payment infrastructure while driving technology strategy, architecture, product engineering and engineering excellence.

Key Responsibilities:

• Own the engineering strategy, architecture and technology roadmap for UPI, BBPS and related payment platforms.

• Lead engineering teams responsible for UPI transactions, BBPS bill-payment infrastructure, payment orchestration, APIs and partner integrations.

• Design and scale high-throughput, low-latency payment systems capable of supporting high transaction volumes and peak loads.

• Drive architecture for transaction processing, routing, reconciliation, settlement, refunds, dispute management and exception handling.

• Build and maintain integrations with NPCI, BBPCU/BBPOUs, banks, TPAPs, PSPs, billers, aggregators and other ecosystem participants.

• Ensure robust transaction lifecycle management covering authorization, processing, callbacks, reversals, retries, reconciliation and settlement.

• Drive engineering practices around microservices, API-first architecture, event-driven systems, Kafka/message queues, caching and distributed databases.

• Lead cloud infrastructure, DevOps and SRE initiatives across AWS/Azure/GCP, Kubernetes, CI/CD, observability and automation.

• Ensure platforms meet stringent requirements around security, availability, scalability, data protection and regulatory compliance.

• Partner closely with Product, Business, Risk, Information Security and Compliance teams to deliver new payment capabilities.

• Drive performance engineering, capacity planning, disaster recovery and business continuity for mission-critical payment systems.

• Establish engineering KPIs covering availability, transaction success rates, latency, throughput, MTTR, deployment frequency, defect density and engineering productivity.

• Build, mentor and scale a high-performing engineering organization and strengthen the engineering leadership layer.

• Drive adoption of AI/ML and GenAI for engineering productivity, automation, fraud/risk analytics and operational intelligence.

BBPS & UPI Expertise:

The candidate should have strong understanding of:

1. UPI:

• UPI 2.0/3.0 ecosystem, PSP/TPAP integrations, collect & intent flows, UPI AutoPay, mandates, refunds, reversals, transaction lifecycle, reconciliation and NPCI integrations.

2. BBPS:

• BBPS ecosystem architecture, BBPCU/BBPOU relationships, biller integrations, transaction processing, settlement and reconciliation, dispute management and integration with banks/fintech platforms.

Ideal Candidate:

• 8-12 years of engineering/technology experience, including 5+ years in senior engineering leadership.

• Strong experience in FinTech, Payments, Banking or BFSI technology.

• Proven experience building and scaling UPI and/or BBPS platforms.

• Strong understanding of NPCI payment ecosystem and bank/PSP integrations.

• Experience managing large engineering teams and multiple technology functions.

• Strong expertise in Java, Spring Boot, Node.js, Python or equivalent, microservices and distributed systems.

• Strong knowledge of Kafka/event-driven architecture, databases, APIs, caching and high-volume transaction processing.

• Hands-on experience with cloud, Kubernetes, DevOps and SRE.

• Strong understanding of payment security, PCI DSS, RBI/NPCI requirements and regulatory controls.

• Excellent stakeholder management and ability to work with senior leadership, banks and ecosystem partners.

Key Success Metrics:

• 99.99%+ platform availability

• Improved UPI/BBPS transaction success rates

• High TPS and low transaction latency

• Reduction in transaction failures and reconciliation exceptions

• Faster incident detection and MTTR

• Zero/minimal material security incidents

• Faster product release and partner integration cycles

• Improved engineering productivity and automation

• Successful delivery of strategic payment technology roadmap