Dry Etch MTS/Principal Engineer, Process Development SG, Advanced NAND

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

As a Dry Etch MTS/Principal Engineer at Micron, you will join a highly skilled team dedicated to groundbreaking next-generation NAND technology. This role offers outstanding opportunities for innovation, collaboration, and the chance to work with innovative dry etch chambers. You will play a pivotal role in crafting flawless processes that meet and exceed program goals.

Responsibilities

Leading Dry Etch Unit Process and Critical Module Development:

• Develop and innovate dry etch processes to meet structural and electrical specifications.
• Collaborate and lead cross-functional teams to solve complex structural problems.
• Present process and technology roadmaps for current and upcoming technology nodes.
• Work on critical modules such as HAR, Tier by tier etches, WL contacts, and staircase.

Interaction with Other Process Areas:

• Find opportunities and drive towards collaborative solutions.
• Direct technology roadmaps for other areas.
• Lead or participate in cross-functional task force groups targeting specific goals.
• Develop knowledge and expertise in related process hardware or technologies.

Interaction with Dry Etch Peers:

• Act as a resource and mentor for peers in dry etch technology and project management
• Provide critical updates to upper management on project status and impacts

Requirements

Successful candidates for this position will have:

• Demonstrated interest in working within a research and development environment
• 3-10 years of experience in dry etch process development within R&D transferring to manufacturing
• 2-3 years of applicable NAND, DRAM, or Logic module development experience
• Knowledge of plasma physics, plasma chemistry, transport, or surface phenomena
• Demonstrated leadership in problem-solving and managing technical projects
• Understanding of various types of plasma dry etch reactors
• Expertise in statistical process control and analysis
• Experience solving scalability problems of deep high aspect ratio silicon/dielectric etches
• Ability to lead supplier head-to-heads
• Preferred experience in data science basics, Python coding, or AI coding