High-Speed Digital Design Engineer
viaPhoton is hiring an onsite High-Speed Digital Design Engineer in Naperville, IL to own the high-speed electrical data path of next-gen 200G+ Co-Packaged Optics products for AI data centers — working on 224G/448G PAM4 signal and power integrity, PCB stack-ups, and SI simulation with tools like ADS and HFSS, while mentoring junior engineers.
- Compensation
- $80K–$150K / yr
- Location
- Naperville, IL
- Work setup
- Not specified
- Seniority
- Not specified
- Employment
- Not specified
- Experience
- 3+ years
- Category
- Hardware
- Posted
Must have
- BS in Electrical Engineering
- 3+ years of hands-on high-speed design experience
- Background in high-speed transceiver or transponder development
- Experience designing and applying 224G/448G PAM4 or PAM6 interconnect
- Familiarity with related OIF-CEI or IEEE standards
- Well-versed in high-speed signaling fundamentals, channel behavior, PCB technologies, and RF design techniques
- Comfortable with SI simulation tools such as ADS or HFSS
- Experience with EMI/EMC evaluation and mitigation
Nice to have
- Ideally for 200G/PAM4+ interconnect
Full description
About viaPhoton
We are changing the norm by being customer-focused, technology-led.
viaPhoton builds custom-engineered fiber optic solutions that power AI infrastructure, data centers, and 5G networks for some of the biggest names in tech. In five years we've grown to a team of 200+ and 4x'd our revenue in the last year alone, and we're just getting started. We're looking for dependable, hardworking people who take pride in their work and want to grow with us.
About the Role
You'll advance the development of 200G+ systems and interfaces for our next-generation Co-Packaged Optics (CPO) products, owning the high-speed electrical data path from concept to production. This is deep, hands-on signal and power integrity work at the cutting edge of AI data center connectivity, and you'll guide and mentor junior engineers along the way.
- Advance the development of 200G+ systems and interfaces for our NPO and CPO products, including 224G/448G PAM4 signal and power integrity (SIPI)
- Own technology selection, architecture, development, integration, and productization of cutting-edge CPO solutions
- Define PCB material selection and stack-ups, and evaluate S-parameters, eye diagrams, crosstalk, jitter, and COM performance
- Assess host (switch fabric and xPU) and optical technologies, including compute fabrics and scale-up/scale-out topologies
- Guide the electrical data path from concept to production, and mentor junior design team members
What You'll Bring
- Have a BS in Electrical Engineering and 3+ years of hands-on high-speed design experience
- Bring a background in high-speed transceiver or transponder development, ideally for 200G/PAM4+ interconnect
- Have experience designing and applying 224G/448G PAM4 or PAM6 interconnect and related OIF-CEI or IEEE standards
- Are well-versed in high-speed signaling fundamentals, channel behavior, PCB technologies, and RF design techniques
- Are comfortable with SI simulation tools such as ADS or HFSS, and with EMI/EMC evaluation and mitigation
Want to read the full job description? High-Speed Digital Design Engineer JD
What's in it for you?
- Robust health, dental, and vision coverage that starts on day 1
- 401(k) with match, vests immediately after a 90-day waiting period
- Flexible PTO that grows over time
- 10 paid holidays, including 2 floating holidays
- Monthly team events
- Click here to view our full benefits overview.