IC Package / PCB Layout Engineer (d/m/f)
ams OSRAM is hiring an IC Package / PCB Layout Engineer in Premstätten, Austria, to design IC package substrates and HDI PCBs using Cadence Allegro and/or Altium Designer. The role requires 6+ years in the semiconductor industry, plus knowledge of signal integrity, ESD/EMC, and packaging technologies like BGA, wirebond, and flip-chip.
- Compensation
- Not disclosed
- Location
- Not listed
- Work setup
- Not specified
- Seniority
- Not specified
- Employment
- Not specified
- Experience
- 6+ years
- Category
- Hardware
- Posted
Skills
Must have
- Bachelor's or Master's Degree in Electrical Engineering, Microelectronics, Semiconductor Physics, Computer Engineering, or related field
- Minimum 6 years experience in Semiconductor/Electronic Industry
- Strong experience with Cadence Allegro Suite (Allegro X, APD, Package Designer) and/or Altium Designer
- Knowledge of controlled impedance routing, electromagnetic coupling, grounding strategies, shielding concepts, and RF matching networks
- Experience with IC package substrates, HDI PCB technologies, BGA, wirebond, and flip-chip packaging
- Good technical English
Nice to have
- Experience with Cadence Virtuoso Suite and Physical Verification Tools (Siemens Calibre/Cadence PVS)
- Knowledge of semiconductor processes, analog/mixed-signal design considerations, and ESD/EMC concepts
- CMOS IC layout experience (parasitic control, matching techniques, device placement, shielding, chip-package-board co-design)
- German language skills
Full description
Who we are looking for
- Bachelor's or Master's Degree in Electrical Engineering, Microelectronics, Semiconductor Physics, Computer Engineering, or a related field
- Minimum of 6 years experience in Semiconductor/Electronic Industry
- Strong experience with Cadence Allegro Suite (Allegro X, APD, Package Designer) and/or Altium Designer
- Experience with Cadence Virtuoso Suite and Physical Verification Tools such as Siemens Calibre/Candence PVS of is highly desirable
- Knowledge of semiconductor processes, analog/mixed-signal design considerations, and ESD/EMC concepts is considered a strong benefit
- Knowledge of controlled impedance routing, electromagnetic coupling, grounding strategies, shielding concepts, and RF matching networks
- Experience with IC package substrates, HDI PCB technologies, BGA, wirebond, and flip-chip packaging
- CMOS IC layout experience is highly desirable, providing valuable expertise in parasitic control, matching techniques, device placement, shielding concepts, and chip-package-board co-design
- Good technical English is a must, German is beneficial
We offer competitive salaries and additional benefits based on your performance, experience and qualification.
The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group G (.
We offer a higher compensation depending on your expertise and skills.
Please contact Hana Krsul for further information via Hana.Krsul@ams-osram.com or +43 664 9665611.