機構工程 Mechanical Design Engineer

服務於前端科技領域，您必須隨時準備應對新的挑戰與問題，您將與多領域 團隊合作，包括機電一體化、光學和電子專家，進行半導體設備平台設計，包括晶圓交換、真空室、振動 隔離與控制、運動系統、框架和模塊佈局等。

角色與職責:

• 系統之概念及細節設計
• 晶圓傳送系統設計
• 微粒控制方法設計
• 真空腔體設計
• 用於在真空室中運行的組件設計及 子組件接口設計 ，包括用於真空系統中的材料的選擇和製造方法
• 震動控制與隔離 方法設計
• 模組大小控制及 佈局
• 為精確定位系統所需的結構及動態特性 需求提供解決方案
• 進行概念驗證及可行性研究
• 打樣件採購
• 原型機組裝及測試
• 系統整合與測試
• 定義組裝及測試流程
• 文件發佈及導入製造

學經歷要求:

• 紮實的機械工程基礎 ，包含設計原理、機械元件、材料及製程
• 精通機械 CAD 設計軟體
• 具光學機構、高真空系統、半導體或類似設備設計經驗者尤佳
• 具熱力、結構分析經驗
• 具良好口語及書面溝通能力

Working at the cutting edge of tech, you'll always have new challenges and new problems to solve – You will work with multidisciplinary teams with mechatronics, optical and electronic experts on the new wafer inspection platform design, which includes wafer exchange, vacuum chamber, vibration isolation and control, motion system, frame and module layout, etc.

In this role successful candidates will be responsible for:

• System concept and detail design
• Design of wafer flow
• Design of particle reduction
• Design of vacuum chamber
• Design of components for operation in vacuum chambers and subcomponent interfaces, including direct material selection and fabrication method for vacuum systems
• Design of vibration isolation and reduction
• Module volume control and layout
• Provide solutions to various structural and dynamic requirements for precision position system
• Perform feasibility studies and proof of concepts,
• Procurement of prototype parts
• Prototype assembly and testing
• System integration and testing
• Create assembly and test procedures
• Documentation release and handoff to manufacturing.

Qualifications

• Strong mechanical engineering fundamentals, including design principles, machine elements, materials, fabrication methods.
• Must be proficient with solid CAD
• Experience in several of these areas is desirable: opto-mechanical systems, high vacuum systems, design of semiconductor equipment or similar instruments, motion controls, vibration isolation, measurement instrumentation, tooling & test fixture design
• Experience in thermal, structural analysis
• Excellent verbal and written communication skills