Manager, Process Engineer (Electroplating)

Applied Materials is seeking a Manager, Process Engineering (Electroplating) to join our Singapore's Advanced Packaging Development Center (APDC) team. This role will lead the development and optimization of next-generation electroplating processes and technologies for advanced semiconductor packaging applications. The successful candidate will manage a team of engineers, drive process innovation, support customer engagements, and collaborate across global cross-functional teams to deliver differentiated products and technology solutions.

Key Responsibilities

• Manage engineers in utilizing techniques to characterize hardware, define methods and new technologies and apply them to characterize hardware, and/or perform hardware characterization on significantly complex systems for entire range of products

• Manage, develop, plan and execute process engineering projects for entire range of products

• Interact with key customers to resolve significantly complex process engineering issues for entire range of products

• Develop and implement new technology, products and analytical instrumentation

• Train, define and implement new methodologies, define and apply new technologies, and/or troubleshoot, perform Root Cause Analysis, and resolve significantly complex process engineering issues for entire range of products

• Generate internal and external documentation for products, presentations and technical reports for integrated products and generate and/or validate process engineering specifications for integrated products

• Contributes to market share gains through technology improvement

Requirements

• Bachelor’s, Master’s or PhD in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, or related field.

• 8+ years of semiconductor process engineering experience, including hands-on expertise in electroplating/electrochemical deposition technologies.

• Strong knowledge of copper plating, wafer-level packaging, RDL, copper pillars, TSVs, and advanced packaging applications.

• Proven experience leading process development, technology innovation, and product qualification in an R&D environment.

• Demonstrated people leadership experience, with the ability to develop and mentor engineering teams.

• Expertise in process characterization, DOE, statistical analysis, troubleshooting, and root cause analysis.

• Strong understanding of plating chemistry, deposition uniformity, defect reduction, and process optimization.

• Experience collaborating with customers and cross-functional teams to resolve complex technical challenges.