Manager Programs 2 - Advanced Packaging
- Compensation
- Not disclosed
- Location
- United States-Florida-Apopka
- Work setup
- Not specified
- Seniority
- Not specified
- Employment
- Contract
- Experience
- 3+ years
- Category
- Not specified
- Posted
Skills
Must have
- Bachelor’s degree with 8+ years of relevant professional experience, Master’s degree with 6+ years of relevant professional experience, or PhD with 3+ years of relevant professional experience in prog
- Demonstrated experience leading programs, projects, or integrated product teams with responsibility for schedule, cost/budget, technical performance, and program deliverables.
- Demonstrated technical experience supporting semiconductor or microelectronics design, fabrication, manufacturing, and/or advanced packaging.
- Demonstrated experience preparing and delivering technical or programmatic communications, including proposals, white papers, program reviews, and/or presentations to customers, program leadership, an
- Demonstrated experience applying Earned Value Management (EVM) and schedule-management principles to monitor program cost and schedule performance.
- U.S. citizenship required.
- Must have the ability to obtain and maintain a U.S. government Secret security clearance.
Nice to have
- Active/current U.S. government Secret security clearance.
- Master’s or PhD in Engineering, Physics, Materials Science, Electrical Engineering, Microelectronics, Semiconductor Engineering, or a related technical discipline.
- Experience managing research, development, manufacturing, and/or technology maturation programs involving microelectronics, semiconductors, or advanced packaging.
- Experience working with U.S. Government, defense, and/or commercial customers to define technical requirements and solutions.
- Experience supporting customer acquisition, capture, proposal development, program planning, and/or program execution processes.
- 5+ years of experience leading semiconductor or microelectronics technology-development, manufacturing, or production programs.
- Experience supporting RF and/or digital system products, capabilities, and enabling technologies.
- Experience applying agile principles, including breaking work into manageable increments, managing parallel work activities, and incorporating regular stakeholder or customer feedback.
- Familiarity with FAR and DFARS requirements.
Full description
RELOCATION ASSISTANCE: Relocation assistance may be available
CLEARANCE REQUIRED FOR START: No
CLEARANCE TYPE: Secret
TRAVEL: Yes, 10% of the Time
Description
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.
The Northrop Grumman Microelectronics Center is seeking an Advanced PackagingProgram Manager, Level 2 to support the Foundry, Test, and Advanced Packaging Operating Unit’s Advanced Packaging team full-time on-site in Apopka, FL. The selected candidate must be able to travel domestically as required by business needs.
For more than 70 years, Northrop Grumman’s Microelectronics Center, part of Northrop Grumman Mission Systems, has pushed the boundaries in this ever-evolving field of microelectronics. Our U.S.-based, government-trusted foundries and state-of-the-art advanced packaging facilities set the standard, designing and delivering millions of defense and commercial microelectronics components each year. From innovative design to precise fabrication, our mission-tailored solutions provide unparalleled performance, ensuring our technology meets the most demanding challenges.
The Advanced Packaging team develops and deploys next-generation microelectronics packaging technologies for future defense & commercial systems. We focus on development, prototyping, maturation, and scaling of advanced packaging technologies to meet the needs of our customers across these industries.
The selected candidate will be responsible for leading business execution for semiconductor wafer post-processing. Their primary objective will be developing advanced packaging proposals, introducing new products and processes, and delivering all contractual requirements to our customers on-cost and on-schedule. They will oversee the development and achievement of all technical objectives, as well as numerous contractual requirements including: managing cost, schedule, and technical performance; leading interfaces with internal and external customers, and company support organizations; supporting insertion of these technologies into customer use cases; identifying volume growth and cost reduction opportunities; and interfacing with technical leadership across our customer base to identify technology needs and timelines to support next-generation microelectronics systems.