Mechanical Engineer - SoC to Rack Integration

We’re a fast-moving, US-Israeli AI startup building next-generation infrastructure for the world’s most demanding AI workloads. Our mission is to accelerate the future of intelligence and make it ubiquitously accessible by delivering full stack custom AI servers optimized for large-scale inference and training.

Backed by top-tier investors and led by industry veterans, we’re scaling rapidly. We seek forward-thinking engineers and operators who thrive in a collaborative environment and excel at solving complex challenges from first principles. If you want to build infrastructure that fundamentally changes what the world can accomplish with AI, come join us!

About the position

We are seeking a Principal Mechanical Engineer to lead the hardware definition of our next-generation AI infrastructure. This is a high-impact individual contributor role where you will serve as the primary technical authority for the physical architecture of advanced server platforms. You will bridge the critical gap between ultra-high-power silicon packaging, liquid-cooled node design, and massive-scale rack deployments.

Responsibilities

• Blade & Chassis Design: Lead the end-to-end mechanical definition of server blades, high-density chassis, and rack-level enclosures.
• Structural Hardware: Architect the integration of sliding rails, blind-mate connectors, precision standoffs, and high-load extraction handles.
• Power & Interconnects: Define mechanical paths for ultra-high-density power delivery busbars and complex cable management systems.
• Cold Plate & Fluid Management: Own mechanical integration of liquid cooling systems, providing design feedback on cold plate layouts, manifold distribution, and QD/leak-mitigation compatibility.
• Thermal Strategy: Support hybrid air/liquid cooling solutions for 1kW+ nodes, collaborating with thermal specialists on CFD-informed design decisions.
• HVM Optimization: Optimize designs for high-volume manufacturing using precision milling, die casting, and complex sheet metal fabrication.
• Environmental Ruggedization: Ensure system integrity against transportation shock and vibration and extreme thermal and humidity cycling.
• Lifecycle Design: Implement Design for Cost (DfC) and Design for Assembly (DFA) principles to ensure seamless serviceability and global deployment readiness.

Requirements

• B.S. or M.S. in Mechanical Engineering.
• Design Experience: 12+ years in design and validation (MDVT) of modular electromechanical chassis and rack level systems in data centers for HPC/AI/Enterprise segment.
• Proven track record of owning at least one full product lifecycle — from concept through high-volume manufacturing (HVM).
• Expert-level understanding of metal fabrication processes including milling, casting, and sheet metal, and how they impact thermal performance and structural integrity.