Package Process Development - Sr. Manager, Engineering
- Compensation
- Not disclosed
- Location
- Not listed
- Work setup
- Not specified
- Seniority
- Senior
- Employment
- Not specified
- Experience
- 3+ years
- Category
- Not specified
- Posted
Skills
Must have
- MS or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related field.
- 12+ years of semiconductor packaging experience with at least 3 years in a technical leadership or management role.
- Strong hands-on experience in RF SiP package development and assembly process engineering.
- Proven track record of successfully launching new package technologies into mass production.
- Deep understanding of semiconductor package assembly processes and equipment.
- Experience with NTI programs and technology transfer to manufacturing.
- Strong knowledge of statistical process control, DOE, FMEA, SPC, and process qualification methodologies.
- Experience working with OSATs and external manufacturing partners.
- Excellent problem-solving, communication, and cross-functional leadership skills.
Nice to have
- Extensive experience with RF front-end modules, wireless communication products, or advanced SiP technologies.
- Knowledge of RF performance impacts associated with package structures and assembly processes.
- Experience with advanced packaging technologies such as: Fan-Out Packaging Wafer-Level Packaging (WLP) Panel-Level Packaging (PLP) Heterogeneous Integration Multi-Chip Modules (MCM) Embedded Component
- Strong understanding of package reliability physics and failure mechanisms.
- Experience supporting automotive, mobile, Wi-Fi, Bluetooth, GNSS, or cellular RF products.
Full description
Description
We are seeking an experienced and highly motivated Senior Manager, Package Process Development to lead the development and industrialization of advanced RF System-in-Package (SiP) technologies. This role will be responsible for driving package process innovation, leading New Technology Introduction (NTI) activities, and establishing robust manufacturing processes that enable high-volume production of next-generation RF modules and SiP products.The ideal candidate possesses deep expertise in RF SiP packaging technologies, assembly processes, process characterization, reliability requirements, and manufacturing scale-up. This individual will collaborate closely with product design, package design, technology development, suppliers, and manufacturing teams to accelerate technology readiness and product commercialization.
Key Responsibilities
Technology Development & NTI
- Lead New Technology Introduction (NTI) activities for advanced RF SiP packaging platforms.
- Develop process roadmaps and technology strategies to support future RF module and SiP product requirements.
- Evaluate and introduce innovative assembly, interconnect, molding, substrate, shielding, and packaging technologies.
- Drive Design for Manufacturability (DFM), Design for Assembly (DFA), and Design for Reliability (DFR) initiatives during product development.
- Partner with cross-functional teams to ensure seamless transition from technology development into production.
Package Process Development
- Own development and optimization of RF SiP assembly processes, including:
- Die Attach
- Flip Chip Assembly
- Wire Bonding
- Wafer-Level Packaging Integration
- Underfill
- Encapsulation/Molding
- Shielding Processes
- SMT and Board-Level Assembly
- Define process windows, critical process parameters, and control methodologies.
- Lead DOE (Design of Experiments), process characterization, root cause analysis, and yield improvement initiatives.
- Establish process specifications, qualification plans, and manufacturing standards.
Manufacturing Readiness & Production Transfer
- Drive process development activities from concept through production release.
- Lead pilot builds, engineering builds, process qualification, and production ramp readiness assessments.
- Develop process control plans and monitoring strategies to ensure consistent manufacturing performance.