Packaging Design and SI/PI Engineer
Mid-to-senior packaging design and signal/power integrity engineer at Lyte, owning the layout of the micro-electronic package at the heart of its Physical AI perception system. Day to day: package/substrate design, SI/PI simulation with EDA tools (Siwave, HFSS, APD), and vendor coordination for manufacturability. Based in Singapore.
- Compensation
- Not disclosed
- Location
- Singapore
- Work setup
- Remote
- Seniority
- Not specified
- Employment
- Not specified
- Experience
- 5+ years
- Category
- Design
- Posted
Skills
Must have
- Bachelor's degree in Electrical Engineering or related field with 5 years of experience
- Fluent in English, able to collaborate with teammates in different time zones
- Experience in substrate design and packaging technology
- Experience in signal and power integrity simulation and interpretation of results
- Experience with EDA tools: Siwave, HFSS, APD, or similar
- Maintain company confidential information
Nice to have
- Master's degree with more experience
- Proactive member of multi-disciplinary team, takes ownership of technical challenges
- Hands-on testing of electronic packages/systems
- Knowledge of device packaging processes (die attach, flip chip, wire bonding) and camera/lidar module assembly
- Experience with other EDA tools: Altium, Allegro PCB, Spectre, Hspice, Sigrity, ADS
- Data analysis experience (e.g. JMP; Excel acceptable)
- Programming and software maintenance skills (Python or C++)
Full description
- About Lyte
Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit
If you’re excited about building impactful technology in a dynamic, hands-on environment, we’d love to hear from you!
About the role
- We are seeking a middle to senior level packaging design and signal/power integrity Engineer with degree in Electrical Engineering, or a related field.
What you'll do
- Own the design and layout of our micro-electronic package, the heart of our LyteCore system
- Collaborate with multi-disciplinary team of engineers (silicon, photonics, system, operations) to define physical and electrical performance specifications for the package
- Perform signal/power integrity simulation to optimize our package & system performance
- Work with our substrate/package vendors to ensure design for manufacturability and support delivery of our design on time. Work with said vendors to define high volume price target.
- Project tracking weekly.
- Write technical reports and present results.
- Maintain EDA tools and actively project future needs, including improving design flow definition and recommending EDA envelope.
Required Qualifications
- Minimal requirement is a bachelor's degree with 5 years of experience
- Fluent in English communication, able to collaborate with teammates in different time zones
- Experience in substrate design and packaging technology
- Experience in signal and power integration simulation and interpretation of the results
- Experience in EDA tools: Siwave, HFSS, APD, or similar
- Maintain company confidential information are a must
Preferred Qualifications
- Master’s degree with more experience is highly desired
- Proactive member of the multi-disciplinary team, takes ownership of technical challenges and work with others to resolve issues
- Experience with hands-on testing of electronic packages/systems.
- Knowledge and experience in at least some following processes: device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module assembly.