Packaging Engineer
Senior package design engineer at AMD in Bengaluru executing end-to-end advanced package designs (substrate layouts, bump maps, interposers) for complex 2.5D/3D chiplet-based products, while improving design methodologies with AI-driven automation. Requires EDA experience (Cadence SIP/APD, Synopsys 3DICC) and SI/PI fundamentals.
- Compensation
- Not disclosed
- Location
- Bengaluru
- Work setup
- Onsite
- Seniority
- Not specified
- Employment
- Full time
- Experience
- 2+ years
- Category
- Not specified
- Posted
Skills
Must have
- Minimum 2+ years of experience designing complex substrates, Silicon Bridges, or interposers
- Bachelor's or higher degree in Electrical Engineering, Computer Engineering, or related field
Nice to have
- Proven ability to execute in multi-project, fast-paced, high-pressure environments
- Strong experience in advanced packaging technologies: 2.5D / 3D integration (interposers, chiplets)
- Hands-on experience with Cadence SIP / APD EDA tools
- Hands-on experience with Synopsys 3DICC or equivalent EDA tools
- Experience working with OSATs, foundries, and substrate vendors
- Solid understanding of Signal Integrity and Power Integrity fundamentals
Full description
Job Summary
Advance your career. Advance the world.
At AMD, we believe technology has the power to solve the world s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.
Whether you're designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger - technology that moves the world forward. Join us and, together, we'll advance your career.
Senior Packaging Engineer
The role
Help turn possibility into reality every day. At AMD, we push the boundaries of what is possible by delivering innovative, high-performance computing solutions across data center, AI, and advanced packaging technologies.
We are seeking a highly experienced Senior Package Design Engineer to support complex package design execution. This role requires a self-driven technical expert who thrives in a fast-paced, dynamic, and high-pressure environment, and can deliver high-quality designs with speed, precision, and scalability.
The successful candidate will play a key role in advancing AMD s packaging methodologies by leveraging AI-driven design techniques, automation, and next-generation workflows to address the increasing complexity of heterogeneous integration and advanced packaging architectures.
The Person
The ideal candidate is an experienced package or silicon physical designer who:
- Demonstrates strong ownership and accountability across multiple programs
- Excels in fast-phase execution environments with competing priorities
- Applies AI/ML and automation to improve design productivity and quality
- Operates with minimal supervision while influencing cross-functional teams
- Balances deep technical expertise with strong collaboration and communication skills
Key Responsibilities
Design Execution & Technical Leadership
- Perform end-to-end package design execution for complex products, ensuring performance, cost, quality, and schedule targets are met
- Handle multiple concurrent design programs in a fast-paced and high-pressure environment
- Develop substrate layouts, bump maps, and interposer designs for advanced packaging (2.5D/3D, chiplet-based architectures)
- Drive design decisions through close collaboration with SI/PI, mechanical, and SOC teams
Cross-Functional Collaboration
- Partner with internal engineering teams, OSATs, and substrate suppliers to deliver optimized solutions