Physical Design (all experience range)
Physical design engineer at a semiconductor company implementing digital blocks and full-chip designs from netlist to tapeout: floorplanning, power planning, placement, CTS, routing, timing closure, and physical signoff (DRC/LVS, IR/EM), with Tcl/Python flow automation. Open to all experience levels (0-30 years), based in Bengaluru or internationally.
- Compensation
- Not disclosed
- Location
- Not listed
- Work setup
- Hybrid
- Seniority
- Not specified
- Employment
- Not specified
- Experience
- 0+ years
- Category
- Design
- Posted
Skills
Must have
- Hands-on experience with ASIC physical design implementation and closure (scope aligned to experience level)
- ASIC design
- Strong understanding of digital design fundamentals, timing concepts, and physical effects (RC, crosstalk, clocking, variability)
- Ability to debug systematically using reports/logs and communicate clear problem statements and action plans
- Comfort working cross-functionally with RTL, verification, DFT, STA, and signoff teams
- Good engineering hygiene: version control, reproducible runs, clean documentation, review-friendly ECO practices
Nice to have
- Experience with industry-standard P&R and signoff tools (e.g., Innovus/ICC2, PrimeTime, Calibre/ICV, RedHawk/Voltus)
- Advanced timing closure experience (useful skew, CRPR, OCV/AOCV/POCV, SI-aware optimization)
- Experience with hierarchical design methodologies, chip-level integration, and multi-die/advanced packaging awareness
- Low-power implementation experience (UPF), MCMM flows, and power integrity closure
- Strong scripting/automation skills (Tcl/Python) and ability to build robust PD utilities and dashboards
- Experience with foundry signoff requirements and tapeout checklists for advanced nodes
Full description
About Tylsemi
Tylsemi is building and scaling high-impact semiconductor operations. We partner across design, manufacturing, and supply chain to bring silicon from concept to high-volume production with speed, quality, and predictable execution.
Role Overview
As Design Team Member at Tylsemi, you will drive the implementation of digital blocks and/or full-chip designs from netlist to tapeout, partnering closely with RTL, verification, DFT, and signoff teams. This role is open across experience levels (0–30 years) and is ideal for leaders and engineers who enjoy solving complex timing, power, and physical constraints to deliver manufacturable, high-quality silicon.
What You’ll Do
- Own physical implementation for blocks/subsystems/top-level: floorplanning, power planning, placement, CTS, routing, and ECO closure
- Develop and refine constraints (SDC) in collaboration with RTL/STA; ensure constraints are consistent, complete, and implementation-ready
- Drive timing closure across modes/corners, including setup/hold closure, clock quality, and path optimization
- Close physical signoff requirements: DRC/LVS, IR drop/EM, antenna, density/fill, and manufacturability checks
- Analyze and resolve congestion, utilization, and routing challenges; propose floorplan/architecture improvements when needed
- Partner with STA and signoff teams to debug violations and implement clean, reviewable ECOs
- Collaborate with DFT on scan/MBIST/DFT constraints and physical requirements; ensure implementation supports testability goals
- Support low-power implementation (UPF/CPF intent awareness), multi-voltage domains, level shifters/isolation, and power gating as applicable
- Create and maintain flow automation, checks, and reporting (Tcl/Python) to improve predictability and execution speed
- Contribute to tapeout readiness: documentation, checklists, design reviews, and root-cause analysis of issues to prevent recurrence
What We’re Looking For
- Hands-on experience with ASIC physical design implementation and closure (scope aligned to level of experience)
- Strong understanding of digital design fundamentals, timing concepts, and physical effects (RC, crosstalk, clocking, variability)
- Ability to debug systematically using reports/logs and to communicate clear problem statements and action plans
- Comfort working cross-functionally with RTL, verification, DFT, STA, and signoff to resolve issues efficiently
- Good engineering hygiene: version control, reproducible runs, clean documentation, and review-friendly ECO practices