Micron
Principal Engineer, Frontend Organizations Central Team, Dry Etch Process
- Compensation
- Not disclosed
- Location
- Hiroshima, Japan
- Work setup
- Onsite
- Seniority
- Principal
- Employment
- Not specified
- Experience
- Not specified
- Category
- Frontend
- Posted
Skills
Must have
- Proven experience in plasma process and hardware improvement and development within the semiconductor industry, specifically in Dry Etch.
- Remarkable skill in developing and implementing hardware CIP roadmaps and start-up acceptance criteria for dry etch chambers and consumable parts.
- Strong analytical skills for evaluating, promoting, and planning new etch platforms, chemistries, and chamber kits (e.g., new electrode materials, edge rings, focus rings, showerheads).
- Tangible results in boosting tool performance, establishing process parameters, and streamlining process management projects.
- Ability to strictly adhere to safety, quality, and sustainability standards while driving innovative solutions.
Full description
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Responsibilities
- Strategize and lead productivity, yield, quality, and cost improvement engagements with global sites and the network team via plasma process optimization, new/FOAK chemistry & hardware qualification, and CIP development collaboration with dry etch suppliers.
- Collaborate with cross-functional teams to drive breakthroughs in defect reduction, particle/residue control, CD uniformity, profile control, and chamber-matching across the global fleet.
- Develop the process and hardware CIP roadmap for Dry Etch — covering chamber parts, RF/match networks, gas delivery, ESC, endpoint, and plasma source upgrades.
- Drive process & hardware improvement with emphasis on safety, defect reduction, cost efficiency, throughput, quality, and sustainability across Dry Etch modules (Conductor Etch, Dielectric Etch, Poly/Gate Etch, Metal Etch, High-Aspect-Ratio (HARC) Etch, Spacer/ALE, etc.).
- Partner with suppliers to establish equipment start-up acceptance criteria, chamber qualification flows, and tool service requirements; work with global facilities to address new tool installation requirements (abatement, exhaust, RF compliance, gas/chemical infrastructure).
- Improve tool efficiency, WPD, and utilization across all Micron Dry Etch fleets through benchmarking, MAXOUT-style productivity programs, and pathfinding solutions.
- Set up IoT/FDC sensors and advanced chamber telemetry for defense-line strengthening in Dry Etch tools and develop new solutions for excursion prevention and chamber-health monitoring.
- Establish and improve process windows and recipe robustness, upgrade process capability (CD, profile, selectivity, ARDE, LER/LWR control), and reduce production costs (consumable lifetime extension, gas usage optimization).
- Enable new solutions for energy savings (RF power optimization, eco-mode), PFC/F-gas abatement, and waste reduction aligned to Micron's sustainability targets.
Qualifications & Skills
- Proven experience in plasma process and hardware improvement and development within the semiconductor industry, specifically in Dry Etch.
- Remarkable skill in developing and implementing hardware CIP roadmaps and start-up acceptance criteria for dry etch chambers and consumable parts.