Coherent Corp. US
Principal Photonics Design Engineer
- Compensation
- Not disclosed
- Location
- Fremont, CA, United States
- Work setup
- Not specified
- Seniority
- Principal
- Employment
- Not specified
- Experience
- Not specified
- Category
- Engineering design
- Posted
Skills
Nice to have
- Experience with co-packaged optics or advanced optical interconnect architectures.
- Experience developing technologies targeting 400G-per-lane or other ultra-high-speed optical links.
- Understanding of semiconductor fabrication processes and how process variations impact photonic device performance.
- Experience working directly with photonic foundries or process development teams.
- Experience with high-speed optical packaging and electrical-photonic integration.
- Experience developing new technologies from early concept through prototype demonstration and product development.
Full description
Primary Duties & Responsibilities
- Develop new photonic device and PIC concepts for next-generation optical interconnects and high-speed communication systems.
- Design and optimize high-speed photonic components and subsystems, with applications targeting technologies such as 400G-per-lane links and co-packaged optics.
- Work on the interaction between photonic devices and their electrical/RF interfaces, including high-speed modulators, photodetectors, transmission lines, electrodes, and interconnects.
- Develop WDM building blocks and architectures, including wavelength filters, multiplexers/demultiplexers, resonant devices, and other wavelength-selective components.
- Translate system-level requirements into practical photonic device and circuit specifications.
- Evaluate design tradeoffs involving bandwidth, optical loss, power consumption, footprint, manufacturability, and scalability.
- Use optical, electromagnetic, and RF simulation tools to model and optimize device performance.
- Develop and tape out complex PICs using foundry PDKs and established silicon photonics design flows.
- Work with foundry and fabrication teams to understand process limitations and incorporate manufacturing considerations into device designs.
- Support experimental characterization and use measurement results to improve future designs.
- Collaborate with electrical and packaging engineers on advanced optical-electrical integration and packaging challenges.
- Contribute to the development of new design methodologies, simulation workflows, and reusable photonic building blocks.
- Help identify and explore new device concepts and technologies that can enable future generations of optical interconnects.
Education & Experience
- PhD or Master’s degree in Electrical Engineering, Photonics, Applied Physics, Optics, or a related field.
- Significant experience in integrated photonics or silicon photonics design and development.
- Experience designing high-speed electro-optic devices and their associated RF structures.
- Experience with electromagnetic and RF simulation tools such as HFSS, CST, ADS, or similar.
- Experience with photonic simulation and design tools such as Lumerical, Tidy3D, RSoft, or equivalent.
- Experience designing WDM components or wavelength-selective photonic circuits.
- Experience taking PIC designs through layout and tapeout using foundry PDKs.
Skills
- Strong understanding of photonic device physics and PIC design.
- Good understanding of RF and electromagnetic effects in high-speed photonic devices, including transmission lines, impedance matching, parasitics, and bandwidth limitations.
- Familiarity with advanced optical communication architectures and the technology challenges associated with scaling data rates and integration density.