Principal Process Engineer, Die Bonding

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry.

As a Principal Process Engineer in Hybrid and Fusion Die Bonding, you will provide technical leadership in the startup, development, qualification, and optimization of advanced die-bonding processes for next-generation semiconductor products. You will apply deep process expertise and data-driven problem solving to improve product quality and reliability, accelerate yield learning, reduce cost, increase productivity, mitigate technical and manufacturing risk, and resolve complex production-line challenges. Working across upstream and downstream process modules, you will lead cross-functional efforts to establish robust process windows, qualify new technologies, and enable scalable manufacturing integration. You will also collaborate with internal equipment-development teams and strategic suppliers to rapidly deploy new systems, shape equipment and process roadmaps, and drive hybrid-bonding requirements across partner organizations.

Responsibilities:

• Develop, diagnose, and resolve various hybrid bonding process technologies
• Coordinate and manage process, equipment, and material evaluation/optimization initiatives and implement changes at process step
• Lead and participate in continuous yield improvement and cost reduction activities
• Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction
• Manage, audit, and be a liaison with material suppliers to achieve quality, cost, and risk management objectives
• Support SPC/FDC/RMS/APC and site-to-site portability
• Support internal and external audits

Minimum Qualifications:

• A BS degree with minimum 8+ years proven experience in Semiconductor Process Engineering
• Solid engineering knowledge of semiconductor advanced packaging die stacking processes
• Skilled at designing valid tests and Design of Experiments (DOE)