Process Engineer, APTD

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Department Intro:

The Advanced Packaging Technology Development (APTD) department at Micron Technology is shaping the future of memory and storage technology through advanced packaging innovation. Our team develops the processes, automation, and manufacturing capabilities that enable next-generation semiconductor products. Working closely with global R&D and manufacturing partners, we turn new ideas into scalable solutions that help maintain Micron’s leadership in the industry.

Position Overview:

As a Process Engineer, you will play a key role in improving the quality, reliability, and manufacturability of future memory products. This position combines hands-on problem solving, process optimization, and cross-functional collaboration in a fast-paced development environment. You will help drive technical advancements, influence technology roadmaps, and contribute directly to the success of next-generation semiconductor solutions.

Responsibilities:

• Optimize automation, equipment, and process performance to improve product quality, reliability, and cost
• Develop and enhance host, automation, and data systems to accelerate learning and decision-making
• Perform root cause analysis and failure investigations using methodologies such as FMEA, 8D, SPC, and FDC
• Partner with equipment, process development, and process integration teams to develop and implement new solutions
• Support pilot line operations and technology transfer to high-volume manufacturing sites

Minimum Qualifications:

• BS with 3+ years of experience, MS with 1+ year of experience, or PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, Physics, or a related technical field
• Experience in semiconductor process engineering, packaging, or advanced package integration
• Knowledge of DRAM, NAND, or other memory technologies
• Experience with design of experiments (DOE), statistical process control (SPC), defect analysis, and data analysis
• Ability to solve complex technical problems using root cause analysis and manage project deliverables effectively

Preferred Qualifications:

• Practical experience applying artificial intelligence tools and systems to engineering or manufacturing challenges
• Experience developing automation, equipment, or data-driven process improvement solutions
• Knowledge of process and equipment interactions across semiconductor manufacturing operations