Process Engineering Manager - Molding, Ball & Die Attach, Bonding, Wet Etch and Cleans

Position Summary:
The Process Engineering Manager – (Molding, Ball & Die Attach, Bonding, Wet Etch and Cleans) leads a team of process engineers and technical contributors responsible for wafer fabrication process development, sustaining, yield improvement, and technology transfer activities across assigned modules. This role provides senior technical and people leadership across thin films, dry etch, wet etch, cleans, plating, electrochemical processing, and related metrology in a cleanroom manufacturing environment.
Primary Scope: Molding, Ball & Die Attach, Bonding, Wet Etch and Cleans, related metrology, module-level integration support, process control, sustaining, development, qualification, and transfer.
Major Area of Accountability:

Lead the engineering team through clear goals, strong performance management, coaching, development, and succession planning.
Build and grow technical capability by strengthening process ownership, enabling knowledge sharing, and delegating meaningful technical responsibilities.
Drive process development, optimization, qualification, and sustaining across molding, attach, bonding, wet etch, cleans, and related metrology processes.
Lead root‑cause investigations, corrective actions, and yield/defect improvements using rigorous statistical, DOE, and process‑capability methods.
Partner cross‑functionally to resolve complex technical issues, support new technology introductions, ensure compliance, and clearly communicate priorities, risks, and resource needs to leadership.

Required Qualifications:
Education

B.S., M.S., or Ph.D. degree in Mechanical Engineering, Electrical Engineering, Chemical Engineering, Materials Science, Physics, or another relevant engineering discipline.

Experience and/or Training

Minimum of 15 years of experience in a wafer fabrication cleanroom environment.
Minimum of 2 years of leadership, supervisory, or management experience, preferably with direct people leadership responsibility.
Experience as a process or area owner for at least two relevant process areas such as Molding, Ball & Die Attach, Bonding, Wet Etch and Cleans related module processes.
Experience working in CMOS, MEMS, photonics, photovoltaic, or heterogeneous integration / advanced packaging fabrication environments.
Demonstrated experience leading structured problem-solving efforts using 8D, 3D, Fishbone, 5 Why, fault-tree analysis, or similar methodologies.
Strong working knowledge of DOE, SPC, process capability analysis, and statistical methods, with the ability to teach and lead others in their application.
Demonstrated ability to lead cross-functional teams, manage multiple technical priorities, and deliver results in a fast-paced manufacturing or development environment.
Strong interpersonal skills with the ability to influence, coach, and develop engineers and technical staff.
Excellent written and verbal communication skills.
Demonstrated ability to meet commitments, manage multiple projects simultaneously, and shift priorities based on business needs.
Passion for leading teams, developing people, and building strong engineering capability
U.S. Person Required: This position requires compliance with the International Traffic in Arms Regulations (ITAR). All accepted applicants must be U.S. Persons. ITAR defines a U.S. Person as U.S. citizen, U.S. Permanent Resident, Political Asylee, or Refugee.

Preferred Qualifications:

Experience wet etch, wet cleans, and contamination control.
Experience supporting advanced materials, specialty semiconductor processes, or customer-specific process flows.
Advanced degree in engineering, materials science, physics, or a related technical field.
Experience supporting both process development and production sustaining environments.
Experience supporting government, aerospace, defense, or other high-reliability customer programs.
Experience with security-sensitive manufacturing environments.

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