Process Integration Engineer
LIGENTEC, a photonic integrated circuits (PIC) company, seeks a Process Integration Engineer in Corbeil-Essonnes to transfer, qualify, and optimize silicon photonics and heterogeneous integration processes from development into production — coordinating with foundry partners, driving root-cause analysis and yield/cost improvements, and using data-analysis tools like Python, JMP, and R.
- Compensation
- Not disclosed
- Location
- Corbeil-Essonnes, FR
- Work setup
- Not specified
- Seniority
- Not specified
- Employment
- Not specified
- Experience
- 3+ years
- Category
- Software engineering
- Posted
Skills
Must have
- Advanced degree in photonics, microelectronics, or a related field
- Minimum 3 to 5 years of experience in PIC development, semiconductor processing, or integrated optics
- Excellent analytical and synthesis skills
- Strong leadership and autonomy
- Good ability to work with cross-functional teams
- Able to adapt communication to situations (internal and external)
- Good computer skills (Python, JMP, R or equivalent) and knowledge of data analysis systems
- Goal oriented and driven to work on next generation photonic technologies
- Proficiency in English
Nice to have
- Experience in integrated optics
- Fluency in French
- Experience in heterogeneous integration, wafer bonding and hybrid integration of III-V or other materials onto silicon platforms
- Hands-on history with automation for high-volume manufacturing and familiarity with industry standard data analysis tools
- Prior exposure to supply-chain and capacity planning for foundry partnerships
Full description
About us
We're a multicultural team of experts pushing the boundaries of what's possible in integrated optics. Our mission is to make photonic integration accessible and industrially scalable. We deliver best-in-class PIC platforms, design enablement, and integrated solutions that empower our customers to innovate faster and bring light-based technologies from concept to production.
About the role
The Process Integration Engineer will lead the transfer, qualification and optimisation of silicon photonics and heterogeneous integration processes from development into production. Working closely with cross-functional teams including process engineering, device design, equipment maintenance, quality and third‑party foundry partners, the role is accountable for establishing robust, repeatable process flows that meet product specifications, yield targets and manufacturing timelines.
Key Responsibilities
Coordinate the development and qualification of new photonic technologies manufactured in external fabs.
Monitor process performance, identify deviations early, and drive rapid root-cause analysis with internal teams and fab partners.
Lead continuous improvement initiatives across photonic performances, quality, yield, cycle-time, and cost.
Analyse performance drifts and translate findings into actionable improvement plans.
Establish correlations between process parameters to support SPC and technology scaling.
Prepare clear technical specifications, track deviations, and ensure timely issue resolution with fab counterparts.
Work closely with design, test, and process teams to secure smooth technology transfer from development to production.
What you bring
Advanced degree in photonics, microelectronics, or a related field.
Minimum 3 to 5 years of experience in PIC development, semiconductor processing, or integrated optics.
Experience in integrated optics is a strong plus
Excellent analytical and synthesis skills
Strong leadership and autonomy
Good ability to work with cross-functional teams
Be able to adapt your communication to situations (internal and external communication).
Good computer skills are required (Python, JMP, R or equivalent) and knowledge of data analysis systems
Goal oriented and driven to work on the next generation photonic technologies
Proficiency in English; fluency in French is a strong plus
Desirable
Experience in heterogeneous integration, wafer bonding and hybrid integration of III‑V or other materials onto silicon platforms.