(Senior) Member of Technical Staff / Director, Process Engineering, Advanced Packaging

Step into a career with ASM, where cutting edge technology meets collaborative culture. ​

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.

Job's mission

As a senior process engineering leader at ASM, you will drive the development of high-thermal-conductivity thin films that enable next generation high-performance computing (HPC) and advanced packaging. You’ll lead a team of experts working on advanced thermal films compatible with rapidly evolving demands of advanced packaging and heterogenous integration, leveraging ALD/PEALD, CVD/PECVD, and related technologies to turn forward looking roadmaps into manufacturable solutions. By translating demanding customer requirements into breakthrough materials and processes, you’ll help position ASM at the forefront of thermal management for heterogenous integration of advanced logic, foundry, and memory devices.

What you will be working on

· Lead and develop a team of process development engineers focused on high thermal conductivity thin films for advanced packaging and HPC applications, fostering innovation, technical excellence, and collaboration

· Own the roadmap to develop thermal films or materials aligned to customer performance and integration requirements.

· Leverage ASM’s ALD/PEALD, CVD/PECVD, and surface preparation expertise to design, optimize, and qualify high thermal conductivity materials and stacks for use in advanced devices and packages.

· Drive high thermal conductivity thin film development, including process optimization for deposition rate, uniformity, materials properties, morphology and bondability.

· Define, influence, and drive new hardware requirements and development in close collaboration with hardware and software engineering teams to meet advanced on high thermal conductivity process specifications and integration schemes.

· Collaborate closely with customers, Account Technology Directors, Product Management, and Business Development to align on high thermal conductivity materials roadmaps with customer device and packaging strategies.

· Partner with corporate and global R&D organizations to deliver new materials, surface preparation schemes, and applications that support critical technology inflections in thermal management and advanced packaging.