MediaTek 聯發科技
Senior Package Design Engineer
- Compensation
- Not disclosed
- Location
- Hsinchu City, Taiwan
- Work setup
- Onsite
- Seniority
- Senior
- Employment
- Not specified
- Experience
- Not specified
- Category
- Engineering design
- Posted
Skills
Full description
- Package design and planning of various product.
- Design & layout of BGA substrate.
- Co-work with package houses for package design
- Development of advanced package technology.
- Package design platform development
Requirements
- MS or above with major in EE, ME, or related field.
- Familiar with Cadence APD/SiP and Autocad is a plus
- Familiar with the design flow of package & BGA substrate is a plus.
- Familiar with the structures of various packages is a plus: PBGA/TFBGA/FlipChip/POP/PiP/SiP/Module/Fanout.
- Familiar with Cadence APD skill language is a plus.
- Familiar with RD layout tool is a plus:
Laker/Virtuoso
Education: Master's Degree