Senior/Staff Mid-End Engineer (3D/Process Integration)
- Compensation
- Not disclosed
- Location
- Singapore, Singapore
- Work setup
- Not specified
- Seniority
- Staff
- Employment
- Not specified
- Experience
- 5+ years
- Category
- Not specified
- Posted
Skills
Must have
- BS/MS/PhD in EE, Materials, Mechanical Engineering, or a related field.
- 5+ years in 3DIC / advanced-packaging / process integration, with at least one product taken to tapeout and through assembly.
- Direct, hands-on experience with TSV and hybrid bonding and a 3D stacking flow (wafer-on-wafer, chip-on-wafer, or SoIC/CoWoS-class).
- Working knowledge of TSMC 3DFabric (SoIC / CoWoS / InFO) or an equivalent foundry 3D ecosystem, including the associated design kits and rule decks.
- Solid grasp of thermal / thermal-mechanical behavior in stacked die and of SI/PI at the die-to-die interface.
- Comfortable owning cross-organization interfaces - foundry, memory IP partner, and OSAT - and translating their constraints into actionable design inputs
Nice to have
- Experience with DRAM-on-logic stacks, HBM-class memory integration, or high-bandwidth memory interfaces.
- Background on AI / HPC accelerators or other high-power, high-bandwidth SoCs.
- Familiarity with thermal/mechanical tools (e.g., Ansys) and 3D physical/signoff flows (Synopsys / Cadence).
- Exposure to stacked-die test and yield debug.
- Experience standing up a 3D-integration methodology on a small team - comfortable being the first/only specialist in the room.
Full description
About Bitdeer:
Bitdeer is a world-leading technology company for Bitcoin mining and AI cloud.
Bitdeer is committed to providing comprehensive Bitcoin mining solutions for its customers. Apart from designing industry-leading ASIC chips and manufacturing mining rigs, the Group handles complex processes involved in computing across the value chain. This includes equipment procurement, transport logistics, datacenter design and construction, equipment management, and network and facility operations. Bitdeer also offers advanced cloud capabilities to customers with a high demand for artificial intelligence.
Headquartered in Singapore, Bitdeer operates globally with a diversified 3 GW energy portfolio, and deploys Bitcoin mining and HPC datacenters in the United States, Bhutan, Norway, Canada, Malaysia, and Ethiopia.
What you'll do:
- Own the WoW stack definition and the TSV / hybrid-bond (HB) interface — partition, bond-pad pitch/array, keep-outs, and alignment budgets — co-defined with the foundry and the memory partner.
- Drive the 3D-aware floorplan inputs: bump/TSV/HB maps, micro-bump and ballmap planning, and die-to-die interface placement, in partnership with Physical Design.
- Define and close DFM and 3D design rules; run design-rule and process-assumption reviews.
- Coordinate thermal and thermal-mechanical (stress / warpage) analysis, and feed mitigations back into floorplan, power delivery, and stack choices.
- Drive 3D signoff: thermal, SI/PI across the die-to-die interface, and known-good-stack assumptions — clean before tapeout.
- Work with DFT on the 3D test strategy (stacked-die test access, IEEE 1838 / known-good-die & known-good-stack) so the integration is testable.
- Manage package / substrate co-design handoff to the OSAT (outsourced): stackup, escape, assembly flow, and yield/reliability considerations.
- Track foundry and memory-partner deliverables and milestones, surface integration risks early, and keep the stack plan aligned with the schedule
Required qualifications:
- BS/MS/PhD in EE, Materials, Mechanical Engineering, or a related field.
- 5+ years in 3DIC / advanced-packaging / process integration, with at least one product taken to tapeout and through assembly.
- Direct, hands-on experience with TSV and hybrid bonding and a 3D stacking flow (wafer-on-wafer, chip-on-wafer, or SoIC/CoWoS-class).
- Working knowledge of TSMC 3DFabric (SoIC / CoWoS / InFO) or an equivalent foundry 3D ecosystem, including the associated design kits and rule decks.