Sr. Staff Thermo-Mechanical Engineer

About Marvell

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

Your Team, Your Impact

We are seeking a Sr. Staff Thermo Mechanical Engineer to join our Advanced Technology Infrastructure team, focusing on mechanical simulation and structural reliability of semiconductor test and validation infrastructure. This role plays a critical part in ensuring the mechanical robustness, dimensional stability, and long term reliability of sockets, test assemblies, handlers/thermal heads and package level interfaces used in next generation high power XPU and Silicon Photonics programs.

You will work at the intersection of mechanical simulation, materials, packaging, test engineering, and manufacturing, applying advanced modeling and experimental techniques to understand stress, warpage, and process induced behavior across the full lifecycle—from early concept through validation and production readiness.

This position is ideal for an engineer who combines deep analytical modeling skills with hands on correlation and enjoys solving complex, multi physics mechanical problems in high stakes hardware environments.

What You Can Expect

• Perform advanced thermo‑mechanical finite element simulations to evaluate stress, strain, deformation, and structural integrity of test sockets, thermal heads, interconnects, fixtures, handlers, and package interfaces

• Lead warpage and deformation analysis for multi‑material assemblies, accounting for CTE mismatch, nonlinear material behavior, temperature gradients, and boundary conditions

• Develop thermal cycling and mechanical fatigue models to predict long‑term reliability, including creep, stress relaxation, and interface degradation

• Create process‑aware mechanical models capturing effects of assembly, cure, reflow, compression, press‑fit, and load‑path evolution through manufacturing and test

• Translate package and test infrastructure requirements into mechanical design constraints and reliability metrics for early architecture decisions

• Correlate simulation results with mechanical testing, thermal cycling data, warpage metrology, and strain measurements to validate and refine models

• Identify mechanical risk drivers and recommend design, material, or process changes to improve robustness, manufacturability, and yield