Sr. System Design Engineer (DUV, VUV plasma sources)

Company Overview

KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, wearable device, voice-controlled gadget, flexible screen, VR device or smart car would have made it into your hands without us. KLA invents systems and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. The innovative ideas and devices that are advancing humanity all begin with inspiration, research and development. KLA focuses more than average on innovation and we invest 15% of sales back into R&D. Our expert teams of physicists, engineers, data scientists and problem-solvers work together with the world’s leading technology providers to accelerate the delivery of tomorrow’s electronic devices. Life here is exciting and our teams thrive on tackling really hard problems. There is never a dull moment with us.

Group/Division

With over 40 years of semiconductor process control experience, chipmakers around the globe rely on KLA to ensure that their fabs ramp next-generation devices to volume production quickly and cost-effectively. Enabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is responsible for creating all of KLA’s metrology and inspection products, is looking for the best and the brightest research scientist, software engineers, application development engineers, and senior product technology process engineers. The Broadband Plasma Division (BBP) provides market-leading patterned wafer optical inspection systems for leading-edge IC manufacturing. Logic, foundry, and memory customers depend on BBP products to detect yield-critical defects for process debug and excursion monitoring at advanced process nodes. BBP flagship products include the 29xx and 39xx series which leverage Broadband Plasma technology to capture a wide range of defects with ultimate sensitivity at the optical inspection speeds needed for inline defect monitoring.

Job Description/Preferred QualificationsResponsibilities:

The candidate will have a lead role in next generation product development, from technology evaluation and selection, specifications development, product validation and verification. Responsibilities will include execution of experiments and simulations to predict candidate system performance and leading a team in trade-off studies required to make major architecture decisions on complex systems. The candidate will be responsible for top level system specifications and flow down to subsystem and component level specifications, system error budgets, interface definition, calibrations, and diagnostics. The candidate must be effective at leading a team of engineers to achieve program goals.

Qualifications:

• Development of next generation DUV and VUV plasma sources for BBP.