Staff Process Engineer, Advanced Packaging CMP
- Compensation
- Not disclosed
- Location
- Boise, ID - Main Site
- Work setup
- Not specified
- Seniority
- Staff
- Employment
- Not specified
- Experience
- 5+ years
- Category
- Industrial engineering
- Posted
Skills
Must have
- BS or MS in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry or Physics with 5+ years of experience in Chemical Mechanical Planarization (CMP) within
- Hands-on experience CMP equipment operation such as AMAT (LKP), EBARA-300X, optical metrology, profilometry, polishing slurries, conditioners, and polishing pads
- Experience in dielectrics/metals CMP process development on Advanced Packaging or other semiconductor technologies
- Understanding of various integration/structural impacts and constraints related to film deposition and other upstream/downstream processes
- Excellent oral and written communication skills with ability to convey messaging and technical concepts in concise and effective manners
Nice to have
- PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry or Physics plus 3+ years of relevant experience
- Skills in data science, modelling, and experience/an interest in leveraging AI to optimize workflows
- A specialized background in 300mm wafer fabrication
Full description
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Department Intro:
The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Our team is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution.
Position Overview:
As a Staff Process Engineer in Advanced Packaging CMP team, you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. This position requires communication and collaboration with associates both within the region and internationally. Strict adherence to Micron Intellectual Property Protection policy is vital. This role will also extensively collaborate with vendors to develop processes that meet integration requirements.
Responsibilities:
- Perform fundamental research, consumables development, and hardware evaluation, as well as test processes for novel applications
- Initiate and manage experiments to widen process margins and evaluate manufacturability of next-generation solutions
- Incorporate best known manufacturing methods into early development phase of upcoming nodes
- Design and implement advanced process monitoring and control methodologies
- Serve in a technical advisory role, contributing to technical projects for improvements to processes, procedures, and equipment
- Define and lead complex, multi-functional projects of critical importance to Micron, helping to define strategic direction
- Provide advice and counsel to management on significant technical issues; Lead and initiate innovation projects through patents/technical papers
- Using AI to improve job functions
Minimum Qualifications:
- BS or MS in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry or Physics with 5+ years of experience in Chemical Mechanical Planarization (CMP) within the semiconductor industry