Thermal Process Engineer
- Compensation
- Not disclosed
- Location
- Vietnam
- Work setup
- Onsite
- Seniority
- Not specified
- Employment
- Not specified
- Experience
- 2+ years
- Category
- Industrial engineering
- Posted
Skills
Must have
- Master’s degree in Mechanical Engineering, Manufacturing Engineering, or related field
- 7+ years experience in manufacturing and process engineering with 2+ years of liquid cooling experience
- Hands-on experience with thermal or fluid-handling hardware
- Strong understanding of: Mechanical tolerances and torque control Assembly processes and tooling Manufacturing quality systems Thermodynamics Heat transfer
- Experience with liquid-cooled servers, network switches, or HPC systems
- Experience working in or with startups
Nice to have
- Familiarity with: Cold-plate design and materials (Cu, Al, Ni plating) TIM characterization and dispensing Leak detection methods (helium mass spec, pressure decay)
- Experience working with hyperscalers or large ODMs
- Knowledge of data-center cooling architectures (DLC, CDU, facility interfaces)
Full description
Company Overview
We are a high-growth startup building next-generation high‑performance switching systems for hyperscale and AI data centers. Our platforms power large-scale cloud infrastructure, GPU clusters, and high-density compute environments where performance, reliability, and thermal efficiency are critical to customer operations.
Position Summary
The Liquid Cooling Process Engineer owns the manufacturing process definition, validation, and scaling of liquid-cooled network products in conjunction with NH engineering. This role bridges thermal design, mechanical design, manufacturing engineering, reliability, and supply chain to ensure liquid-cooling solutions—cold plates, manifolds, hoses, quick-disconnects, and TIMs—are repeatable, leak-free, thermally efficient, and production-scalable.
The role is critical to enabling >50–100 kW per rack architectures, supporting next-generation AI fabrics and ultra-high-bandwidth network switches without compromising reliability or serviceability.
Key Responsibilities
Process Definition & Development
- Define end-to-end manufacturing processes in close collaboration with engineering for:
- Direct-to-chip cold plates
- Manifolds and distribution plates
- Tubing, hoses, and quick-disconnects (QDs)
- TIM application (grease, PCM, gap fillers)
- Develop process flow diagrams, control plans, and work instructions
- Ensure processes are DFM/DFA/DFS compliant and serviceable in field environments
NPI Execution (EVT → DVT → PVT → MP)
- Enable fast prototyping and rapid iterative development cycles
- Drive development of DFMEA (Design Failure Mode Effects and Analysis) with engineering
- Support thermal hardware from early EVT through HVM ramp
- Identify and mitigate process risks:
- Leak paths
- Torque variation
- Flatness and coplanarity
- Particulate contamination
- Lead process validation builds and golden line definition
- Partner with ODMs to ensure manufacturability at scale
Assembly, Tooling & Automation
- Specify and qualify:
- Torque tools and sequencing strategies
- Dispensing systems for TIMs and sealants
- Pressure and leak-test equipment (air, helium, liquid)